|Asst Prof (Steve) Cuong Dang||- OptoElectronic Devices
- LEDs, Lasers, Quantum Emitters
|Assoc Prof Ang Diing Shenp||1. Reliability physics and characterization of nanoscale transistors (negative-bias temperature instability, hot-carrier effects, gate oxide breakdown, low frequency/RF noise, metal gate/high-kappa gate stack, non-volatile memories, silicon-on-insulator transistors, nanowire devices etc.)
2. Nano-characterization techniques (conductive atomic force microscopy, high-resolution transmission electron microscopy and associated anaytical techniques for alternative gate dielectrics, nanowire devices etc.)
3. Characterization of novel devices (e.g. tunneling FETs, novel memories etc.)
|Assoc Prof Anupam Chattopadhyay||Computing Architecture
|Assoc Prof Boon Chirn Chye||Please See link below for more publications and awards.
PI: Industry: Wireless Heterogeneous Network Transceiver Chipset for Content-Driven Transmission of Learning Media (SLE-RP3) Research Area (SLE), 1st July 2016 to 30th June 2021.
PI: Monolithic Terahertz Passive Components in Advanced CMOS Technology: From Fundamental Understandings to Integrated Circuit Applications, 1st November 2016 to 31st October 2018.
PI: Industry: Circuit Design for GaN Based DC-DC Converter Power, 1st June 2016 to 31st December 2018..
Industry: An Integrated Platform Approach Towards Non-Invasive Continuous Blood Glucose Monitoring Addressing Clinical Need for Early Diagnosis and Improved Compliance, 1st July 2016 to 30th July 2018.
PI: Industrial Grant (Fortune 500 Company) 10GiFi research & development of ultra-wideband RF transceiver, S$927,840.00, 15th July 2014 to 14th July 201.
PI: High Thermal Resolution Ultra-Low Power Integrated Imager: Fund. Issues in CMOS, $840,000, July 2013 to June 2016, AcRF Tier 2 MOE.
PI: Project 2: Electronic Circuit Design, Communication, S$391,560, April. 2012 to March 2013, LEES-SMART-IRG.
PI: Project 2: Electronic Circuit Design, Communication, S$376,200, April. 2013 to March 2014, LEES- SMART-IRG. Due to his excellent work and performance, he was again awarded this subcontract.
PI: Project 2: Electronic Circuit Design, Communication, S$836,400, April. 2014 to March 2016, LEES-SMART-IRG.
Recently, due to the outstanding feedback on Jan 2014 LEES Annual Review Meeting, he was further awarded a large subcontract amount of S$836,400 as PI under the “Low Energy Electronic Systems” from April 2014 to March 2016. LEES Annual Review Meeting is attended by all the PIs and Scientific Advisory Board (SAB) members which include Prof. Timothy David Sands who was recently appointed as President of Virginia Tech, USA.
PI: Ultra-low Power Fully Integrated CMOS 24GHz Receiver, $0.323mil, March 2008 to February 2011, AcRF Tier 1 MOE.
PI: Batteryless Flexible Transceiver for Biomedical Applications, $1,186,270 including scholarships), May 2009 to April 2012, AcRF Tier 2 MOE.
Co-PI: An Ultra Low-Power RFIC Chip For Wireless and Communication Applications S$1.2 mil, March 2006 to February 2009, funded by Agency for Science, Technology and Research (A*STAR).
Co-PI: System-on-chip: Realization of Software Radio, S$0.3 mil, 3 December 2008 to 2 December 2009, University of Electronic Science and Technology (UEST) of China-NTU Joint R&D, jointly funded by UEST and NTU.
Co-PI: An Ultra Low-Power RF Transceiver Chip towards a New Paradigm of Life Quality, S$0.25 mil, 3 December 2008 to 2 December 2009, NRF.
Key Collaborator: “Low Energy Electronic Systems” which has won the Singapore-MIT Alliance for Research and Technology (SMART) International Research Grant (IRG) proposal with a grant total of S$25million.
Various JIP programs.
|Assoc Prof Chan Pak Kwong||Dr Chan’s research interests are in areas of mixed-mode circuits and systems, precision analog circuit design, integrated circuit analysis and circuit theory & applications. He initiated SENSOR CIRCUITS & SYSTEMS research, focusing on
• Sensor interface ICs for biomedical, chemical, environmental and nanotechnology based sensors;
• Sensor systems based on highly-accurate instrumentation circuits or intelligent design techniques;
• Ultra low-voltage low-power low-noise circuit design techniques;
• Power management ICs for integrated sensors and system-on-chip;
• PVT-Insensitive circuits and systems
|Prof Chang, Joseph Sylvester||Joseph Chang is multi-disciplinary engineer with research encompassing core CAS-related fields including analog, digital and aerospace circuits/systems; biomedical/life-sciences related-fields; and the emerging printed-electronics. He received the B.Eng (ECE) from Monash University, and Ph.D. from the Department of Otolaryngology, Faculty of Medicine, University of Melbourne, and has two-years IC-related industrial-experience. He is currently with the Nanyang Technological University, Singapore (and Adjunct at Texas A&M).
He has contributed to senior university administration and to ECE undergraduate/graduate education. He was the inaugural Associate-Dean of Research-and-Graduate-Studies at the 660 faculty-strong College-of-Engineering. For undergraduate education, he emphasized on promoting and instilling undergraduates’ interest in ECE, including being the chair of the Undergraduate-Research-Experience-on-Campus and Undergraduate-Research-Opportunities-Program programs, chaired Orientation-Programs and national-level undergraduate-conferences, and has given several talks in high-schools.
In the IEEE, he contributed to both core and multi-disciplinary fields, including as Guest-Editor of the Proceedings-of-the-IEEE on ‘Computational System-Biology’, Guest-Editor of the CAS-Magazine on ‘Special-Issue on Life-Sciences’, Editor of the CAS-Magazine’s Open-Column, Chairperson of the IEEE-NIH Life-Sciences-Systems-and-Applications (LiSSA) Workshop, Chairperson of two IEEE-NIH CAS-Medical-and-Environmental (CASME) Workshops, Chairperson of the LiSSA Technical-Committee, Associate-Editor of IEEE TCAS-I (3-terms) and -II, Associate-Editor of the IEEE CAS-Magazine, Distinguished-Lecturer, etc. Of specific interest, he organized the successful merging of the BioCAS and LiSSA technical-committees, largely for CAS’s concerted/united life-sciences efforts. He was instrumental in several non-IEEE establishments’ engagement in CAS’s activities, including other IEEE societies, National-Institutes-of-Health, Telemedicine-and-Advanced-Technology-Research-Center, American-Institute-of-Medical-and-Bioengineering, etc. Impact thereto includes NIH’s request for each of their 27 institutes a copy of the aforesaid CAS-magazine’s special-issue, representation by different IEEE societies at the IEEE-NIH workshops and NIH financial support for CASME.
He has published over 200 referee-reviewed publications (primarily in IEEE) and has over 20 patents (awarded/pending). In the field of ‘Class-D amplifier’, he has the most number of publications in the IEEE; and the top-ranked paper (excluding patents) and four of the top six papers in ‘Digital Class-D Amplifier’ in Google Scholar. He has received numerous grants from local and international funding-agencies (including DARPA and the EU) and from industry, amounting to >US$10M. He has founded two startups, and has designed numerous ECE-related products for industry.
His research interests are largely emerging technologies, including bioengineering, microfluidics, audiology, psychoacoustics, and analog and digital circuit designs. He leads a group of 25 researchers - externally funded - including from DARPA (USA) and from the European Union. Some description of his work may be found in the following editorials of the Proceedings of the IEEE and the IEEE Circuits and Systems Magazine (where he served as a Guest Editor):
J. Chang, S. Wong, R. Newcomb and P. Häfliger, ‘Third Revolution in Medicine – the Convergence of Life Sciences with Physical Sciences, Mathematics and Engineering’, IEEE Circuits and Systems Magazine, Special Issue on Life Sciences, Aug 2012
S. Wong, M. Ogorzalek and J. Chang, ‘Editorial on the Special Issue on Computational Systems Biology’, The Proceedings of the IEEE, Aug 2008
|Assoc Prof Chen Tupei||Past and current research topics / interests include
1) Nanoscale CMOS devices and reliability physics; ULSI technology
2) Semiconductor and metal nanocrystals/nanoparticles and their applications in nanoelectronic and photonic devices;
3) Novel memory devices (nanocrystal Flash memory, RRAMs/CBRAMs, analog memory, WORM, 1T-DRAM, etc.);
4) Memristors and applications in AI chips (electronic neuron & synapse);
5) Si photonic devices (Si-based light emitters, on-chip optical interconnects);
6) Flexible/transparent electronic devices and applications (transparent/flexible high mobility thin-film transistors / thin film memory / thin film circuits, transparent display, high-resolution touch panel, electronic skin, large-area flexible x-ray & ultrasonic imaging films, etc.);
7) Solar energy-related materials and devices (nanostructured spectrally selective absorbing coating for concentrating solar power, anti-reflection coating with capabilities of down-converting UV light and IR rejection for solar cells, smart thermochromic / photochromic / electrochromic / PDLC materials & devices, etc.).
|Prof Chen Zhong||Thin Films & Low-dimensional Materials: Thin films & nano-materials for clean energy and environmental applications; Microelectronic thin films; Protective and functional surface coatings.
Mechanical Behavior of Materials: Fracture, fatigue, and creep of bulk monolithic & composite materials, thin films and multi-layers; Experimental and computational mechanics.
|Prof Gan Chee Lip||A/Prof Gan's research area is on microelectronics interconnect systems, spanning from reliability of conventional Cu/low-k interconnects, to three-dimensional (3D) interconnects and nanowires interconnects. Dr Gan's current research interests include the reliability study of advanced interconnect systems, such as copper electromigration, time-dependent-dielectric-breakdown of low-k dielectrics and new assessment methodology for circuit level reliability projection. Another area of research is on the process integration and reliability of 3D interconnects through copper-copper wafer bonding. Fabrication of metallic nanowires by a template method as interconnects is also being investigated. Work is carried out to characterize the morphology and electrical properties of the nanowires to assess its suitability for actual applications.
|Assoc Prof Goh Wang Ling||Digital/mixed-signal IC designs:-
1) Wireless implantable neural recording IC for motor prosthesis,
2) 3D IC design for 100 GHz Application,
3) Class D amplifier,
4) Field-Programmable Gate-Array-Based Investigation of Coding and Detection for Ultra-High Density Magnetic Recording.
As well as Silicon-On-Insulator (SOI) process technology, SOI devices and Nanowire transistors.