|Assoc Prof Pang Hock Lye, John|
Division of Engineering Mechanics
School of Mechanical & Aerospace Engineering
College of Engineering
Phone: (+65)6790 5514
- PhD University of Strathclyde 1989
- BSc(Hons) University of Strathclyde 1985
|John H. L. PANG is an Associate Professor at the School of Mechanical and Aerospace Engineering of Nanyang Technological University. He received his PhD degree in 1989 and BSc degree in 1985 from the University of Strathclyde, Glasgow, UK. He joined Nanyang Technological University in 1990. His academic interests are in Mechanics of Materials and Design for Reliability (DFR). He has published over 160 peer-reviewed journal and technical conference papers and has a SCI Web-of-Science (PANG JHL OR PANG HLJ), h-Index of 22, and over 1447 citations. He serves in the Editorial Advisory Board of the International Journal of Fatigue and is Associate Editor for the IEEE Transactions on Components, Packaging and Manufacturing Technologies. He is a Fellow of the American Society of Mechanical Engineers (FASME). He serves as Co-Director of the SIMTech-NTU Joint Laboratory on Reliability at the School of Mechanical and Aerospace Engineering (MAE).|
|His current research work includes Design-For-Reliability (DFR) assessments for laser additive remanufacturing technology, Materials-Process-Performance (MPP) characterizations, Elastic-Plastic-Creep (EPC) mechanics of lead-free (Sn-Ag-Cu) solders, Fitness-For-Service (FFS) assessments of welded joint and offshore structures. His research contributions to design-for-reliability (DFR) methodologies for lead-free solder has been documented in his book on Lead Free Solder : Mechanics and Reliability, Springer, 2012. (ISBN 978-4614-0462-0, e-ISBN 978-4614-0463-7). It covers lead-free solder mechanics, finite element modeling, simulations of failure for thermal cycling, cyclic bending, vibration fatigue and impact drop tests. He has research interest in Digital Image Correlation (AFM/DIC) analysis, Strain rate effects in Nano-indentation, CNT characterization and application.|
|Research Grant |
- A*SERC Innovations in Remanufacturing Programme (2011-) [by A*STAR Science & Engineering Research Council (SERC)]
- Academic Research Fund Tier 1 (2008-) [by MOE]
|Current Projects |
- Framework for remanufacturing process qualification based on fatigue durability performance assessments
- Fundamental Research on Strain rate Induced Effects in Ductile to Brittle Failure mechanisms
- Laser Cladding material-process-performance fatigue investigations
- Methodology for remanufacturing components subject to contact fatigue and wear
- Sun Gengzhi; Zhou Jinyuan; Yu Feng; John H L Pang, Lianxi Zheng. (2012). Electrochemical capacitive properties of CNT fibers spun from vertically aligned CNT arrays. Journal of Solid State Electrochemistry, 15(5), 1775-1780.
- Huang Z.; Kumar P.; Dutta I.; John H.L. Pang et al. (2012). Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions. Journal of Electronic Materials, 41(2), 375-382.
- Sun G, Huang Y, Zheng L, Zhan Z, Zhang Y, Pang JHL, Wu T, Chen P. (2011). Ultra-sensitive and wide-dynamic-range sensors based on dense arrays of carbon nanotube tips. Nanoscale, 11, 4854-4858.
- Che F.X., Pang JHL. (2009). Vibration reliability test and finite element analysis for flip chip solder joints,. Microelectronics Reliability, 49(7), 754-760.
- Wong CK , John H.L. Pang, et al. (2008). The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectronics Reliability, 48, 611-621.